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Dongguan Ziitek Electronic Materials & Technology Ltd.
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CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled

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CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled

CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled

High-Density conductive thermal pad For CPU The TIF760QE is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives ...

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