Thermal Silicone Pad 3.2W, Ultra High Conductivity Gap Filler For AI Servers,

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Thermal Conductive Glue [15]
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Sponge Foam Material [13]
PET Double Sided Tape [11]
Thermal Gap Pad [406]
Thermal Conductive Gel [24]
Silicone Foam Gasket [11]
Silicone Free Gap Filler Pad [12]
Shielding Absorbing Materials [19]
Thermal Conductivity Sharp Metal [2]

Dongguan Ziitek Electronic Materials & Technology Ltd.

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Thermal Silicone Pad 3.2W, Ultra High Conductivity Gap Filler For AI Servers,

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Thermal Silicone Pad 3.2W, Ultra High Conductivity Gap Filler For AI Servers,

Thermal Silicone Pad 3.2W, Ultra High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is ...

Product Tags:

Thermal silicone pad for GPU cooling

High conductivity gap filler for AI servers

3.2W thermal conductive pad

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