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Ultra Soft 2.0W/mK High Compression Thermal Pad For Battery Pack Thermal Management

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Ultra Soft 2.0W/mK High Compression Thermal Pad For Battery Pack Thermal Management

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Density(g/cm³) : 2.5

Brand Name : ZIITEK

Model Number : TIF4120

Certification : RoHs

Place of Origin : China

MOQ : 1000pcs

Price : Negotiation

Supply Ability : 10000/day

Delivery Time : 3-5work days

Packaging Details : 1000pcs/bag

Thickness : 3mmT

keywords : High Compression Thermal Pad

Thermal conductivity : 2.0W/mK

Feature : Ultra soft and High Compression

Products description : Ultra Soft 2.0W/mK High Compression Thermal Pad For Battery Pack Thermal Management

Payment Terms : T/T

Application : Battery Pack Thermal Management

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Ultra Soft 2.0W/mK High Compression Thermal Pad For Battery Pack Thermal Management
TIF®400 Series Overview

TIF ®400 Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

Key Features
  • 3mm thickness
  • Good thermal conductivity
  • Moldability for complex parts
  • Soft and compressible for low stress applications
  • Naturally tacky - no additional adhesive coating required
  • High tack surface reduces contact resistance
Applications
  • Display card
  • Mainboard/mother board
  • Notebook
  • Power supply
  • AI server
  • Medical equipment
  • Unmanned aerial vehicle (UAV)
  • Robot
  • Wireless Charger
Technical Specifications of TIF®400 Series
Property Value Test Method
Color Yellow Visual
Construction Ceramic filled silicone elastomer -
Thickness range (inch/mm) 0.010"~0.020" (0.25~0.50mm) | 0.030"~0.200" (0.75~5.00mm) ASTM D374
Hardness (Shore 00) 65 | 45 ASTM 2240
Density (g/cm³) 2.5 ASTM D792
Recommended Operating Temperature (℃) -40-200℃ -
Breakdown Strength (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 5.0 ASTM D150
Volume Resistivity (Ohm-cm) >1.0×10¹² ASTM D257
Thermal conductivity (W/m-K) 2.0 ASTM D5470 / ISO22007
Flame Rating V-0 UL94 (E331100)
Product Specifications

Standard Thickness: 0.010" (0.25 mm) – 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Ultra Soft 2.0W/mK High Compression Thermal Pad For Battery Pack Thermal Management
Our Services

Online Service: 12 hours, inquiry reply within fastest response time

Working Time: 8:00am - 5:30pm, Monday to Saturday (UTC+8)

Well-trained & experienced staff available to answer all inquiries in English

Standard Export Carton or marked with customer's information or customized packaging

Free samples available

After-Service

Even though our products undergo strict inspection, if you find any parts not working properly, please provide proof and we will help resolve the issue with a satisfactory solution.

Frequently Asked Questions
Q: What is a Thermal Silicone Pad?

A: A thermal silicone pad is a pre-formed thermal interface material typically made of a silicone-based material and thermally conductive fillers. It is designed to fill gaps between heat sources and heat sinks. Depending on the product formulation, thermal silicone pads can also provide electrical insulation.

Q: What are the advantages of Thermal Silicone Pads?

A: Key advantages include easy installation, controlled thickness, good flexibility, and effective gap-filling capability. Depending on the application, thermal silicone pads can also be designed with different levels of thermal conductivity, hardness, flame resistance, and electrical insulation.

Q: Is a thinner Thermal Silicone Pad always better?

A: Not necessarily. If the pad is too thin to adequately fill the actual gap, proper interface contact may not be achieved. The appropriate thickness should be selected based on the actual structural tolerances and application requirements.

Q: What are the common thicknesses of Thermal Silicone Pads?

A: Different product series can be available in thicknesses ranging from very thin pads to several millimeters or even thicker options. The appropriate thickness should be determined based on the customer's gap, compression requirements, and assembly structure.

Q: Can Thermal Silicone Pads be customized in size?

A: Yes. Thermal silicone pads can be customized according to the customer's product structure, including length, width, thickness, and complex shapes. Die-cutting, punching, and other processing methods can also be used to produce customized parts.


Product Tags:

thermally conductive filler

      

thermal conductivity silicone

      

Thermal Gap Filler Ultra Soft

      
Quality Ultra Soft 2.0W/mK High Compression Thermal Pad For Battery Pack Thermal Management for sale

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