Smart Phone Green 2.0W/MK Thermal Conductivity Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
The TIF®140-20-18S use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
Features
> Good thermal conductivity: 2.0 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> Easy release construction
> Electrically isolating
> High durability
Applications
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
| Typical Properties of TIF®140-20-18S Series |
| Property | Value | Test method |
| Color | Green | ****** |
| Construction &Compostion | Ceramic filled silicone elastomer | ****** |
| Thickness range | 0.020"(0.5mm)~0.200"(5.0mm) | ASTM D374 |
| Specific Gravity | 2.65 g/cc | ASTM D297 |
| Hardness | 45 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ****** |
| Dielectric Breakdown Voltage | > 5500 VAC | ASTM D149 |
| Dielectric Constant | 4.7 MHz | ASTM D150 |
| Volume Resistivity | 7.3 X1013 Ohm-meter | ASTM D257 |
| Flame rating | 94 V0 | UL E331100 |
| Outgassing(TML) | 0.35% | ASTM E595 |
| Thermal conductivity | 2.0 W/m-K | ASTM D5470 |
Product Specification
Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied, Please contact us for comfirming.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
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Smart Phone Green 2.0W/MK Thermal Conductivity Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB Images
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