Multiple Thickness Factory Thermal Pad Thermally Conductive Silicone Pad For Electric Products
The TIF®100-10UF Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
Features
> Good thermal conductive: 1.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> RoHS complian
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance
> Easy release construction
Applications
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Memory Modules
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
| Typical Properties of TIF®100-10UF Series |
| Property | Value | Test method |
| Color | Gray | ****** |
| Construction &Compostion | Ceramic filled silicone elastomer | ****** |
| Thickness range | 0.020"(0.5mm)~0.200"(0.50mm) | ASTM D374 |
| Specific Gravity | 2.2g/cc | ASTM D297 |
| Hardness | 75 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ****** |
| Dielectric Breakdown Voltage | > 5500 VAC | ASTM D149 |
| Dielectric Constant | 3.9 MHz | ASTM D150 |
| Volume Resistivity | 1.0 X1012 Ohm-meter | ASTM D257 |
| Flame rating | 94 V0 | UL E331100 |
| Outgassing(TML) | 0.35% | ASTM E595 |
| Thermal conductivity | 1.5 W/m-K | ASTM D5470 |
Product Specification
Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied, Please contact us for comfirming.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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