Higt Thermal Conductivity 6W/MK Thermal Conductivity Thermal Pad For AI Processors
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
The TIF®600G Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between costand performance.
Features:
> High thermal conductivity: 6.0W/mK
> Good flexibility and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
> Easy release construction
> Electrically isolating
> High durability
Applications
> AI Servers, Inverters, Telecom Devices
> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
| Typical Properties of TIF®600G Series |
| Property | Value | Test method |
| Color | Garnet | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Density(g/cm³) | 3.4 | ASTM D792 |
| Thickness Range(inch/mm) | 0.020~0.030 (0.50~0.75) | 0.040~0.200 (1.0~5.0) | ASTM D374 |
| Hardness | 60 Shore 00 | 45 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant | 4.5 MHz | ASTM D150 |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 |
| Flame rating | V-0 | UL 94 (E331100) |
| Thermal conductivity | 6.0 W/m-K | ASTM D5470 |
| 6.0 W/m-K | ISO22007 |
Product Specifications
Standard Thickness: 0.020"(0.5 mm)-0.20" (5.00 mm) with increments of 0.010 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes: FG (Fiberglass) provides enhanced strength,
suitable for materials with thicknesses of 0.010” to 0.020” (0.25mm to 0.50mm)
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q:How can we get detailed price list?
A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.
Q:Do big buyers have promotional prices?
A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.
Product Tags:
|
|
High Thermal Conductivity 6W/MK Thermal Conductive Pad with 60 Shore00 Hardness and 3.4 Density for AI Processors Images
|
